ACF Tape For LCD Panel Repair

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  • 10 - 99 Pieces
    $55.00
  • >=100 Pieces
    $50.00
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Overview
Quick Details
Place of Origin:
China
Dimension(L*W*H):
2.0*50mm
Certification:
CE ISO9001
Suitable for:
LCD Bonding
Warranty:
1 Year
After-sales Service Provided:
No overseas service provided
Supply Ability
Supply Ability:
1000000 Piece/Pieces per Month
Packaging & Delivery
Packaging Details
in original packing
Port
hongkong
Lead Time :
1 day
Product Description

Product Application

 ACF Tape, ACF Film
ACF Tape is normally made up of two main components, namely Adhesive & conductive particles.
Adhesives
The adhesive composition is dependent on the materials being assembled. This means an ACF designed for use in a flex-on-glass (FOG) assembly is usually not suitable for use in a chip-on-glass (COG), FOB, or any other configurations. It is specific to the application for which it is designed for.

ACF Conductive Particles

Conductive particles are used to conduct electricity from one side of the bond to the other. Depending on the application, conductive particles range from 3.5μm to 30μm in size, and can be made from Nickel-gold plated polymer spheres, gold plated nickel particles, or lead-free solder materials. Particles may be individually coated with a outer polymer to insulate them from other uncrushed particles, but which will crack open and allow electrical conduction if the particle is trapped and crushed between two pads during assembly.


ACF Anisotropic Conductive Film

ACF (Anisotropic conductive film) or ACF tape is an epoxy adhesive system used by electronics industry to make electrical and mechanical connections from drive electronics to substrates.
ACF are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).
The conductive particles are distributed far apart thus not electrically conductive in the plane direction (X&Y) of the film.
ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.
ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.

ACF Bonding
During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.
Conductives particles (each 3~30um) are compressed between IC and substrate (glass / PCB) while insulating materials pushed away.
This allows the compressed Ni-Au layer on the particles to conduct electricity between the IC and the substrates (z-axis).
The insulated particles are distributed with a minimum chance of electrical shorting in the x-axis and y-axis.
As the epoxy cures and conductive particles are trapped into permanent compressed form.
The compressed particles, by its elastic nature, are constantly pushing outwards to maintain good electrical conductivity under different environmental conditions.
ACF has for many years, been used in glass display applications. Recently, it is also becoming widely used in COF and COB areas.
Examples of ACF applications.
 TAB Bonding (TCP-PCB / TCP-LCD)

- COG Bonding (IC-LCD)

- COB Bonding (IC-PCB)

- COF Bonding (IC-FPC)

- Plasma Display (FPC-PDP)

- Flip Chip Package

Main Features

1) Simple structure in linear type ,easy in installation and maintation. 

2) Adopting advanced world famous brand components in pneumatic parts ,electric parts and operation parts. 

3) High pressure double crank to control the die opening and closing. 

4) Running in a high automatization and intellectualization,no pollution 

5) Apply a linker to connect with the air conveyor ,which can directly inline with filling machine . 

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